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Universal
Semiconductor offers rugged, miniature, and high sensitivity MEMS
process capability for manufacture of sensors, transducers, switches,
mirrors, and many diverse special custom designed products that go into
wide ranging applications from medical to aerospace. The MEMS
integrated sensor chip can be readily combined with a signal
conditioning circuitry chip for amplification, offset compensation,
linearity improvement, and temperature compensation. All parameters for
amplification, offset compensation, linearity improvement, and
temperature compensation are stored in an internal EEPROM. No additional
components required, simplifies incorporation in to existing systems.
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Features: |
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Applications: |
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Miniaturization |
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Medical Equipment |
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Multi Function
Integration |
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Process Automation |
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Bi Directional
Senses |
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Pressure Measurement |
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High
Sensitivity |
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Flow Measurement |
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Superior
Linearity |
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Leak Detection |
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Optimum
Repeatability |
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Temperature
Control |
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Excellent
Reliability |
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Reduces Mfg.
Cost |
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PIN FUNCTIONS
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Pin |
Function |
Specifications: |
Figures: |
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1 |
+ In (+3V) |
Pressure
Accuracy (psi) |
1.0 |
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2 |
- In (3V) |
Pressure
Range (psi) |
0 -100 |
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3 |
+ Out |
Temperature Range (deg F) |
40 -
200 |
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4 |
- Out |
Peak Temp (deg F)
|
- 40 -
300 |
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5 |
Temperature Sensor |
Temperature Accuracy |
5.0 |
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