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PRESS
RELEASE
FOR IMMEDIATE RELEASE
For More
Information, Contact:
Fred Garcia
August 25, 2008
Universal Semiconductor,
Inc.
Tel: +1 (408) 436 - 1906
Fax: +1 (408) 436 - 1125
fgarciausi@sbcglobal.com
www.universalsemiconductor.com
USI Announces USA Based
Micro-Optics Wafer Scale Business Unit
SAN
JOSE – August 25, 2008 - Universal Semiconductor, Inc., (USI), today
announced it’s expansion of the Micro-Optics Wafer Scale Services
offering a Turn Key design, prototyping and wafer fab production
services.
USI is no
stranger to the emerging high growth Micro-Optics Wafer scale
technology. For some three years coupled with the addition of pioneering
experts in the field of Micro Optics, we have gained considerable
experience and perfected Micro-Optic processes for our OEM customers
said Vic. Hejmadi, CEO and President of USI.
USI is
unique in it’s knowledge, experience, and design and modeling
capabilities in the field of binary and multilevel diffractive optics,
hybrid refractive/diffractive and micro-refractive optics. USI uses
highly effective custom-built CAD/CAM/CAE software to design, model and
generate the mask layouts for micro-optical elements.
USIs
lithographic fabrication of the multilevel process achieves high field
overlay accuracy, as well as resist reflow or gray scale masking in
conjunction with dry proportional etching which enables USI to provide
its customers the full spectrum of state of the art micro-optics
fabrication processes.
By their
very nature, Micro-Optical elements have a typical footprint of only a
few square millimeters and are usually less than 1 mm thick, making them
ideal for applications in which space is at a premium. In addition,
millions of components per month can be manufactured with high
reliability and precision. So, it is easy to see why cost-effective
Micro-Optic components are now fulfilling their promise by replacing
conventional optics in common products like mobile phones,
light-emitting-diode (LED) lighting, and flat-panel displays.
The use
of diffractive, hybrid diffractive/refractive and micro-refractive
elements allow the designer a high degree of freedom to optimize a much
more cost effective and low power consumption component for a given
application said Fred Garcia, VP Marketing and Sales.
“USI
now addresses the high-growth market of Micro-Optic by expanding our
Turnkey Foundry and Design Services, complimenting our ASIC, MEMS, and
Photodiode Sensor products and services thus resulting in lower costs,
greater performance and power benefits to the customer from a USA based
company,” said Vic Hejmadi, CEO and President of USI.
FOR IMMEDIATE RELEASE
For More
Information, Contact:
Universal Semiconductor, Inc.
Tel: (408) 436 -
1906
Fax: (408) 436 -
1125
sales@universalsemiconductor.com
www.universalsemiconductor.com
Universal Semiconductor (USI) expands its Turn Key wafer
fab capabilities to include 6” wafer now offering 2", 3", 4", 5" and 6"
wafer foundry services.
USI’s expanded lithography equipment includes new
submicron ASML PAS 2500/40 Stepper Aligner, Spinners, Lam and Tegal Dry
Plasma Etchers for up to 6” wafers.
USI’s expanded Metal Deposition and Diffusion
processes provide a diverse range of standard processes or custom
<1 micron to
5 micron feature size or larger.
USI’s Patent Semiconductor technologies and processes
include CMOS, DMOS, Bipolar devices, Double Diffusion
Photodiodes / Detectors and Solar Cells.
USI offers a Turnkey Foundry resource for its customers that is
extremely capable
and competitively priced,
said Vic Hejmadi, CEO and President of USI.
USI’s new 6” fab services will commence in May 2006 in
addition to our on-going 2”- 5”. We also offer selected processes for 6”
and 8” wafers said Vic Hejmadi.
USI utilizes its Semiconductor process technology,
infrastructure and expertise by providing our customers with
Made-In-America products that are cost effective, and reliable said Vic
Hejmadi.
Universal Semiconductor is a private company founded in
1978, headquartered in San Jose, CA, is a custom-built class 10/1000 plant located in the
heart of Silicon Valley at San Jose, CA. The facility contains R &D,
design engineering, custom and semi custom wafer fabrication, production
test, prototype fabrication, sales and marketing, support,
development, and manufacturing for its branded, custom and Foundry
services.
USI offers a wide and diverse patented technology mix
that have been designed to operate on the same chip: Analog/Digital;
High Voltage Smart Power; CMOS, DMOS; Bipolar: RC/D Arrays, RF FETs,
Photodiode, and Solar Cell.
For more information please visit USI’s Website at
www.universalsemiconductor.com
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PRESS RELEASE
May
2004 FOR IMMEDIATE RELEASE
For More Information,
Contact:
Fred Garcia
Universal Semiconductor, Inc.
Tel: (408) 436 1906 X 43
Fax: (408) 436 1125
sales@universalsemiconductor.com
www.universalsemiconductor.com
Universal Semiconductor (USI) expands its product offering with the
addition of a line of Diffused Junction Silicon Photosensors for the
defense and commercial markets.
The line of linear and Dual Axis Position, PIN and long Line series of
Silicon Photodetectors offer rugged reliability, high resolution and
long term stability at an extremely competitive price said Vic Hejmadi,
CEO and President of USI.
Production of Silicon Photodiode Sensors actually commenced in the 4th
quarter of 2003 and this year we will triple the production capacity and
have plans to offer new products in the 4th quarter of 2004 said Vic
Hejmadi.
USI utilizes its Semiconductor process technology, infrastructure and
expertise by providing our customers with Made-in-America products that
are cost effective and reliable, said Vic Hejmadi.
Universal Semiconductor is a private
company founded in 1978, and is headquartered in a custom build class 10
plant located in the heart of Silicon Valley, San Jose, CA. The
facility contains R &D, design engineering, custom and semi custom wafer
fabrication, production test, Prototype fabrication, sales and
marketing.
USI offers a wide and diverse technology mix that have been designed to
operate on the same chip: Analog/Digital; High Voltage Smart Power;
DMOS, DMOS; Bipolar; RC/D Arrays and RF FETs.
For more information please visit USI's Website at
www.universalsemiconductor.com
Top
PRESS RELEASE
August
2003 FOR IMMEDIATE RELEASE
For More Information,
Contact:
Fred Garcia
Universal Semiconductor, Inc.
Tel: (408) 436 1906 X 43
Fax: (408) 436 1125
sales@universalsemiconductor.com
www.universalsemiconductor.com
Universal Semiconductor (USI) has expanded into
the MEMS technology
market place and announces it's family of Pressure, Flow, and
Temperature sensors for the automotive, medical, and commercial markets.
Universal Semiconductor's facility
headquartered in San Jose, Ca is responsible for the development and
manufacturing of Micro Electro Mechanical Systems (MEMS) for use in
specific applications.
Universal Semiconductor will offer
custom application specific products as well as the manufacturing of
MEMS chip and package level products to it's offering of semi custom and
custom family of products and Fab Foundry services said Vic Hejmadi, CEO
and President of USI.
The first production released is the
Pressure Sensor Chip that is integrated with a highly sensitive
piezoresistive pressure transducer, which provides an accurate, and
linear voltage output. The Pressure Sensor Chip contains a temperature
sensor and test package and EEPROM for operational parameters all on 1
chip that minimizes costly engineering time and manufacturing cost.
The Pressure Sensor Chip is
specifically designed for applications such as liquid/pneumatic, flow,
and temperature compensator, for medical or a vast array of other like
applications.
USI utilizes its Semiconductor process
technology, infrastructure and expertise by providing our customers with
miniaturized, cost effective, and reliable functions that is all on a
single chip; a win-win solution for all said Vic Hejmadi.
Universal Semiconductor is a private
company founded in 1978, and is headquartered in a custom build class 10
plant located in the heart of Silicon Valley, San Jose, CA. The
facility contains R &D, design engineering, custom and semi custom wafer
fabrication, production test, Prototype fabrication, sales and
marketing.
USI offers a wide and diverse technology mix that
have been designed to operate on the same chip: Analog/Digital; High voltage Smart Power; CMOS, DMOS;
Bipolar: RC/D Arrays, and RF FETs.
For more information please visit USI's Website at www.universalsemiconductor.com
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